Chair in Smart Materials

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Topics/Research and Teaching Profile

The Smart Materials Chair covers the materials engineering and materials testing of functional and structural materials within the engineering degree programmes (materials for electrical engineering, sensor materials, special materials / materials testing, testing methods for coatings and surfaces, Fracture mechanics / component behaviour and damage analysis / material selection). Research focuses on fracture mechanics problems (cyclic crack growth, crack resistance under quasi-static loading) and process-microstructure-property relationships, as well as the application of machine learning models to identify relevant causal relationships. We are open to research collaborations with partners from Saxony, Germany and abroad, from both industry and academia. Do you have any questions about our teaching and research programmes? Please feel free to contact us! 

Holder of the Chair

Prof. Dr.-Ing. Kristin Hockauf
Prof. Dr.-Ing. Kristin Hockauf
FakultƤt Ingenieurwissenschaften

Our team

M.Eng. Frank Poschmann
FakultƤt Ingenieurwissenschaften
M.Eng. Fritz Backofen
M.Eng. Fritz Backofen
FakultƤt Ingenieurwissenschaften
Dr.-Ing. Ulrike HƤhnel
Dr.-Ing. Ulrike HƤhnel
FakultƤt Ingenieurwissenschaften
Dipl.-Ing. Andreas Eysert
FakultƤt Ingenieurwissenschaften
Dipl.-Ing. Tom Kreißig
Dipl.-Ing. Tom Kreißig
FakultƤt Ingenieurwissenschaften
Enrico Gehrke
FakultƤt Ingenieurwissenschaften

Laboratory equipment

Computed tomography

Room 5-238 B | Room 7-018

  • Porosity/Inclusion Analysis
  • Wall thickness analysis
  • Fibre-reinforced composite analysis

Emission spectrometry | Differential thermal analysis

Room 5-239 B

  • Chemical Analysis of Engineering Materials
  • Access to materials databases

Corrosion testing

Room 5-103 A

  • Conducting neutral salt spray tests and condensation tests

Metallography

Room 5-235 B | Room 5-236 B | Room 5-237 B

  • Metallographic sample preparation
  • Assessment of thin sections and thin films (ceramics and plastics)
  • Microstructural analysis (examination of material structure under a light microscope)
  • Hardness measurement of microstructural components (phases)
  • Laser scanning microscopy

Scanning electron microscopy

Room 5-238 B

  • Fracture surface analysis
  • Identification of failure mechanism or cause of failure:
     
    • static or dynamic overload
    • corrosive attack, etc.
  • Elemental analysis (EDX) of unknown residues on components
  • Mapping and line scan for colour-coded element distribution

X-ray fine structure

Room 5-234 B

  • Qualitative and semi-quantitative phase analysis
  • Texture and stress measurements

Materials used in electrical engineering

Room 5-233 B | Room 5-111 A

  • Characterisation of dielectric materials
  • Characterisation of piezoceramic materials (small-signal and large-signal behaviour)
  • Magnetic behaviour of materials
  • Non-destructive film thickness testing using probe technology (eddy current, magnetic inductive)
  • Conductivity behaviour of materials

Key areas of research

Current projects

What's new?

News from Research and Teaching

What is the HSMW?

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Mittweida University of Applied Sciences is a boundless testing ground aimed at driving business and society forward. How? Through academically trained specialists and straightforward collaboration, which enables regional businesses to benefit directly from our findings – or to gain new insights through joint research projects that can be put into practice straight away. We enable students to test their limits by developing their own skills and exploring new horizons.

6.350
Students
590
dedicated staff
100
Partner universities worldwide
161
Years at HSMW
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